At Nanosystems JP Inc., we fabricate the small optical parts quantum and sensing hardware cannot buy off the shelf: double-side patterned windows, Ti/Au films, metal apertures, and fine meshes on sapphire and fused silica, through-glass holes by unfilled TGV, and Si-glass bonded cell bodies. We have shipped Ti/Au patterned fused silica windows and 1.3µm through-hole aluminum mesh on sapphire, so this page describes work our line has already done. From single pieces and single wafers, managed end to end by a dedicated project manager.
Optics shops do not pattern; fabs do not polish
A patterned window falls between two industries: optics houses supply beautiful blanks but no lithography, and most fabs will not touch a 0.5mm fused silica disc. Our fused silica wafer program plus full lithography closes the gap, one order, one drawing, one part number.
Three capabilities define the service, and each one has already left the building on a customer's part.
Ti/Au electrodes, contact pads, alignment fiducials, and opaque field masks patterned directly on fused silica and sapphire windows, on one face or both, aligned front to back. We have shipped Ti/Au on fused silica; polishing, thickness tolerance to ±10µm, and TTV below 5µm on precision grades come through the fused silica wafer program the windows are cut from.
Metal apertures, beam-defining stops, and periodic meshes by lift-off on transparent substrates, down to the 1.3µm through-hole aluminum mesh we delivered on sapphire. Hole size, pitch, and fill factor per your optical design, in Al, Ti/Au, or other evaporable metals, with the pattern placed to your fiducials.
Through-glass holes by unfilled TGV for beam access and fill ports, DRIE cavities in silicon, and Si-glass stacks joined by anodic, adhesive, or eutectic bonding, the building blocks of cells, chambers, and windowed housings. Coatings, including the SiO₂/TiO₂ AR stacks of our photonics flow, are coordinated per program.
One drawing of the part this page sells: electrodes on top, aperture on the back, a through-glass hole, and a 1.3µm-class mesh in the inset.
| Parameter | Specification |
|---|---|
| Substrates | Fused silica, sapphire, borosilicate glass, Si for bodies; others on request |
| Formats | Wafers 4-8 inch; chip-scale rectangles and discs per drawing |
| Metals | Ti/Au, Al, Cr, and other evaporable systems; lift-off patterned |
| Feature Sizes | Mesh holes from ~1µm class (1.3µm shipped); apertures and pads per design |
| Sides | Single or double, front-to-back aligned |
| Thickness / Flatness | ±10µm thickness tolerance; <5µm TTV on precision-grade fused silica |
| Through-Holes | Unfilled TGV in glass / fused silica, Ø20µm class standard; Cu fill optional |
| Bonding | Anodic, adhesive, eutectic Si-glass stacks; open halves or bonded bodies |
| Coatings | AR (SiO₂/TiO₂ class) and functional coatings coordinated per program |
| Deliverable | Finished parts: patterned, cut, inspected, optics-packed |
| Minimum Lot | From 1 piece or 1 wafer; repeat lots on the same recipe |
Patterned windows and bonded bodies for alkali vapor cells and miniature vacuum chambers, electrode-carrying glass where the physics wants field plates right at the volume.
Apertures, beam stops, and through-holes that define and admit laser paths in ion and atom hardware, positioned to the same fiducials as the electrical pattern.
Fine conductive meshes on transparent substrates where a field or shield must coexist with a view, the shipped 1.3µm sapphire mesh being exactly this part.
Windowed flow cells, patterned reference apertures, and chambered optics for instruments, drawing on the same Si-glass bonding as our microfluidics line.
Miniaturized optical assemblies for OPMs, clocks, and deployable sensors, where every part must be batch-fabricated, not hand-made, to reach volume.
Single windows, single meshes, single bonded chambers from a sketch and a phone call, the parts that otherwise stall a PhD for a semester.
Ti/Au fused silica windows and the 1.3µm sapphire mesh are delivered parts. This page describes a lane the line already drives in.
Substrate, polish grade, pattern, holes, bond, and dicing on one part number, closing the gap between optics houses and fabs.
Front-to-back alignment is routine here, so electrode-and-aperture pairs land where the optical design put them.
Fused silica, sapphire, and glass run through this line daily, handled, cleaned, and packed to optics expectations.
TGV holes, seal rings, vapor-cell bodies, and cryo metallization live on adjacent pages, one program covers the whole assembly.
Single parts are quoted and built without a production-order lecture, and repeat lots inherit the exact recipe.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will respond within 24 hours. Full quote typically within 7-10 business days, subject to project complexity and NDA requirements.