At Nanosystems JP Inc., we specialize in comprehensive semiconductor, MEMS, nano-fabrication and other pure-play foundry services, from substrate procurement through to diced chips, delivered worldwide.
We work with engineers, R&D teams, startups, and manufacturing organisations that need dependable fabrication support without building internal process infrastructure. Our role is to translate process requirements into wafer-level execution, from early prototyping through production-scale builds.
Cleanroom fabrication to ISO standards, executed with the precision and attention to detail Japan is known for globally.
Substrate sourcing, mask preparation, process execution, dicing, and delivery can be managed within one program.
Small-lot prototyping from 1-5 wafers with no prohibitive minimums. R&D through to production scale without changing foundry.
NDA available before you share any design details. Your technology stays protected from first contact to final delivery.
Engineer-led communication, project discussions handled with technical input from the beginning.
Global logistics and English-language technical support for international R&D teams.
Nanosystems JP Inc. is headquartered at Marunouchi Trust Tower, in the heart of Tokyo's business district, close to Tokyo Station.
Nanosystems JP Inc.
株式会社ナノシステムズJP
Level 20, Marunouchi Trust Tower
1-8-3 Marunouchi, Chiyoda-Ku
Tokyo 100-0005, Japan
✉ [email protected]
📞 +81-3-5288-5569
🌐 www.nanosystemsjp.co.jp
At Nanosystems JP Inc., we offer a complete range of front-end and back-end semiconductor processes, from bare substrate to fully packaged chip.
Substrate procurement, mask fabrication, photolithography (20nm-4µm), nanoimprinting, thin film deposition (100+ materials), electroplating, etching, annealing, ion implantation, CMP, and dicing.
TSV fabrication, TSV reveal, TGV fabrication, wafer bonding (8+ methods), RDL fabrication, UBM, C4 bumping, AuSn bump services for silicon photonics, and full packaging assembly.
Glass/silicon/polymer biochip fabrication, organ-on-chip, MEA devices, silicon photonics waveguide processing, LIGA electroforming, and roll-to-roll thin film deposition.
At Nanosystems JP Inc., a process engineer will review your inquiry personally. We respond within 24 hours, with a full quote typically within 7-10 business days, subject to project complexity and NDA requirements.
Process requirements, substrate type and size, production volume, and your target timeline. GDS/DXF files are not required at this stage.
An NDA can be arranged before any design files or technical details are shared, just mention it in your first message.
Initial response within 24 hours. Full quote within 7-10 business days once all project information is confirmed.