From substrate sourcing to diced chips, semiconductor, MEMS, advanced packaging, and nano-microfabrication for customers worldwide.
Small-lot prototyping through production. Technical review within 24 hours of inquiry.
Precision fabrication from Japan, accessible to the world. Delivered with Startup Speed.
Manufactured to exacting Japanese quality standards with experienced export logistics serving customers worldwide.
4-11 weeks depending on process complexity, competitive with US and EU foundries.
NDA available on request. All projects handled with full confidentiality.
Your inquiry is reviewed personally by technical sales and process engineers within 24 hours.
We work with your team to develop and optimize non-standard processes. From novel materials to unique stack requirements, if it can be done in a cleanroom, we can assess feasibility and define a practical process flow.
Multi-process flows combining lithography, deposition, etching, bonding, and TSV in a single coordinated project. Substrate sourcing through to diced chip delivery, managed under one project with no hand-offs between vendors.
We deliver complex multi-process fabrication by integrating lithography, deposition, etching, bonding, and TSV within a single coordinated workflow.
Innovation shouldn't be gated by volume. We support orders as small as 1–5 wafers, the same Japanese manufacturing precision and attention regardless of order size. The same for a university startup as for a Fortune 500.
Your inquiry is reviewed personally by technical sales engineers and process engineers. Feasibility reviews within 24 hours, direct access to cleanroom expertise from day one.
You receive project status updates at each major process milestone, from photolithography through to dicing. You are never left wondering where your project stands.
Our TSV/TGV and advanced packaging capabilities cover the full fabrication sequence, supporting 3D IC integration, through-glass via interposers, and MEMS-CMOS stacking.
Microfluidic chips, lab-on-chip, biosensors, DNA sequencing substrates, implantable MEMS.
GaAs/GaN HEMTs, RF MEMS switches, SAW/BAW filters, 5G components.
MEMS accelerometers, gyroscopes, pressure sensors, tactile sensors.
SiC/GaN power devices, energy harvesting MEMS, photovoltaic test structures.
Silicon photonics, LIDAR, optical MEMS, infrared detectors, metalens fabrication.
High-reliability MEMS sensors, pressure transducers, inertial measurement units.
How to work with us
Email your project brief, process requirements, substrate, wafer size, quantities, and timeline. GDS/DXF files welcome but not required at this stage.
A process engineer reviews your design for compatibility and feasibility. You receive a detailed quote with process specs, timeline, and pricing within 7-10 business days.
Confirm process traveller and wafer specs. An NDA can be signed at this stage if preferred. Purchase order raised, fabrication is scheduled and begins.
All processes executed with regular status updates. Wafers inspected with CD-SEM, optical, and electrical test. Full inspection report provided.
Wafers diced to your specification. Individual chips packaged or mounted on carrier substrates per your requirements.
Cleanroom-packaged, tracked international shipping to your door. Standard lead time of 4-8 weeks inquiry to delivery, depending on process complexity.
Share your process requirements, substrate, and production volume. A Nanosystems JP Inc. engineer will respond within 24 hours. Full quote typically within 7-10 business days, subject to project complexity and NDA requirements.